These wands are ideal for die and small semiconductor wafer handling. They handle a delicate and fragile wafer, part-wafer or die gently and precisely. The wands are available in ESD safe plastic or Teflon. A wide variety of nozzles in sizes down to just 80 microns in diameter are available in various sizes and materials to suit the application. Suction cups from 2.5 mm in diameter are also available for use where the application permits. Furthermore, our flat wafer handling tips can be used for large dies where contact on the back is possible. Our unique control valve ensures reliable suction and instantaneous release. See also 'Lightweight parts handling' on our Applications page.