Applications



Semiconductor wafer handling

These wands are the safest means of wafer handling, and are offered in both PTFE and ESD safe materials. The tips are optimally sized for each wafer diameter, and their design ensures that contact is both minimal and secure. The contact surface itself is optically polished, providing excellent adhesion to a wafer. Tips are available in PCTFE, PEEK and Vespel. Two body styles are available, fixed tip and swivel joint, offering a choice of handling techniques. Our unique wand control valve ensures reliable suction and instantaneous release without particle generation.

Semiconductor wafer handling


Semiconductor die handling

These wands are ideal for die and small semiconductor wafer handling. They handle a delicate and fragile wafer, part-wafer or die gently and precisely. The wands are available in ESD safe plastic or Teflon. A wide variety of nozzles in sizes down to just 80 microns in diameter are available in various sizes and materials to suit the application. Suction cups from 2.5 mm in diameter are also available for use where the application permits. Furthermore, our flat wafer handling tips can be used for large dies where contact on the back is possible. Our unique control valve ensures reliable suction and instantaneous release. See also 'Lightweight parts handling' on our Applications page.

Semiconductor die handling


Electronic component handling

These wands offer precise, delicate and reliable handling and are ideal for picking up a wide range of components. Typical applications include all types of printed circuit board work, instrument and general small parts assembly, watch and camera work, lens handling and jewellery making. Wand bodies are available in ESD safe plastic or Teflon. A wide variety of tips, including suction cups and nozzles, is available, with many material and size options.

Electronic component handling


Lightweight parts handling

Very lightweight objects such as contact lenses and very thin die require a special handling technique. Our purpose-designed vacuum-blow pump and special wand are perfect for delicately handling very lightweight objects. Such objects may adhere to a suction cup or nozzle when picked up by vacuum. However, the special pump and wand deliver a gentle positive pressure on release, so that the lens or other lightweight object is released in a controlled way. A selection of tips is shown, and other sizes are available.

Lightweight parts handling


Fibre-optics and fine wires

These wands are designed for handling fibre-optics and are fitted with special 'slit tips'. They are also ideal for use with fine wires or other small, round components and offer precise, delicate and reliable handling. Wand bodies are available in ESD safe plastic or Teflon. The specially formed tips are available in PCTFE and conductive nylon. Our unique wand control valve ensures reliable suction and instantaneous release.

Fibre-optics and fine wires


Jewellery and watch making, and artwork restoration

These wands offer precise, delicate and reliable handling and are ideal for picking up objects that would be difficult to handle by other means. Delicate, fragile and awkwardly shaped pieces may be exactly positioned without damage. Wand bodies are available in ESD safe plastic or Teflon. A wide variety of tips, including suction cups and nozzles, is available, with many material and size options.

Jewellery and watch making, and artwork restoration
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